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EMU series (Mask CD-SEM)

EMU series (Mask CD-SEM)

Holon has commercialized the world first CD-SEM incorporating aberration corrector*1 to correspond with ultra-fine patterns, which improves image resolution by 50% to 1.5nm at 1kV.
This is an integral part of key technologies to achieve the industry-leading level of precision repeatability.
On the other hand, we have developed the optimum solution for charge-up suppression and achieved charge-less CD measurement for all types of masks. The system is designed to observe and measure not only EUV mask but Nanoimprint template.

*1: Joint development with JEOL Ltd.

Basic Specifications
Image Resolution 1.5nm (1kV)
Static Repeatability 0.3nm (3σ)
Dynamic Repeatability 0.45nm (3σ)

Mask CD-SEM EMU-270

As the issue of charging has been very critical to small features, adoption of the “Wind-SEM” system enables steady measurement for all types of masks including the AEI (after etching inspection).
It makes it possible to handle easy-to-charge up quarts wafers, too.
The “Wind-SEM” is the charging control system by arousing a certain wind while keeping a pressure high in the specimen chamber.

Basic Specifications
Image Resolution 3nm (1kV)
Static Repeatability 0.4nm (3σ)
Dynamic Repeatability 0.6nm (3σ)

EBLITHO™ (EB-Stamper)

EBLITHO™ (EB-Stamper)

•EB-Stamper, “EBLITHO” which is suitable for fine patterning and mass-production, enables precision & non-contact printing for the photonic crystal structure onto the Epi-substrate.
•Use of a stencil mask enables the high throughput, thus, leading to the lower CoO (Cost of Ownership).
•EBLITHO can process printing of small features into a large area mold (10mm□) for nanoimprint in 10 seconds.

Basic Specifications
  • 2”～6 ”φ substrates processable
  • Stage available for warpage of a 200nm substrate (Option)

CF seriese (Charge-Free SEM)

CF seriese (Charge-Free SEM)

Holon has developed charge-free SEM, CF-01 for a wide range of fields using the technology established for observation and CD measurement for insulating photomasks.
It enables observation for insulating materials including quartz without metal coated.

The system, CF-01 suppresses charging-up with “Wind” aroused in the main chamber while keeping the pressure high in it.

Basic Specifications
  • Image Resolution: 4nm (1kV)
  • 2”～6 ”φ substrates processable

DIS seriese (Mask Defect Imaging System)

Mask Defect Imaging System 「DIS-05」

The system enables a review of micro defects and particles detected by optical inspection tools and then, classifications using SEM images. Observation, image capture and classification can be automated.
It provides the function of simulation to see how defects on a mask is printed onto a wafer and can compare patterns written on a mask with CAD data.

Basic Specifications
Data Comparison Die-to-Data Base, Die-to-Die
Image Resolution 3nm
Defect data import KLARF (KLA results file), CSV Files